Sevilla 14 IEEE

General Chair:
 J.L. Huertas Diaz – CNM (E)
O. Novak - Czech Tech. Univ. (Cz)
Program Chair / Vice Chair:
J.-P. Teixeira – IST/TUL, INESC-ID (P)
E. Gramatova – Slovak Acad. Sc. (SK)
Topic Chairs:
 B. Becker – U. Freiburg (D)
 S. Hellebrand – U. Paderborn (D)
 H. Kerkhoff – U. Twente (NL)
 E. Larsson – Linköping U. (S)
 R. Leveugle – TIMA (F)
 P. Muhmenthaler – Infineon (D)
 N. Nicolici – McMaster U. (CAN)
 M. Renovell – LIRMM (F)
Industrial Relations Chair:
P. Harrod - ARM Ltd (UK)
Publication Chair:
 C. Metra – U. Bologna (I)
Panel Chair:
 H.-J. Wunderlich – U. Stuttgart (D)
Tutorial Chair:
P. Girard – LIRMM (F)
Embedded Tutorial Chair:
 P. Prinetto –  Politecnico di Torino (I)
ETS Fringe Workshops:
 B. Al-Hashimi – U. Southampton (UK)
Ph.D. Forum Chair:
I. Polian – U. Freiburg (D)
Regional Liaisons:
 L. Carro – UFRGS (BR)
 A. Singh – Auburn U. (USA)
A. Osseiran – Edith Cowan U. (AUS)
S. Kajihara – Kyushu IT (J)
Program Committee:

E. Aas, N L. Miclea, RO
M. Abadir, USA S. Mir, F
R. Aitken, USA S. Mitra, USA
Z. Al-Ars, NL Y. Miura, J
D. Appello, I F. Novak, SLO
F. Azais, F O. Novak, CZ
M. Azimane, NL A. Orailoglu, USA
L. Balado, E S. Ozev, USA
A. Benso, I A. Pataricza, H
G. Carlsson, S Z. Peng, S
K. Chakrabarty, USA F. Poehl, D
W. Daehn, D I. Polian, D
R. Dorsch, D I. Pomeranz, USA
M.-L. Flottes, F J. Raik, EE
H. Fujiwara, J J. Rajski, USA
F. Fummi, I A. Richardson, UK
D. Gizopoulos, GR J. Rivoir, D
E, Gramatova, SK B. Rouzeyre, F
S. Hamdioui, NL A. Rubio, E
M. Hirech, USA A. Rueda, E
A. Hlawiczka, PL K.K. Saluja, USA
M. S. Hsiao, USA P. Sanchez, E
P. Hughes, UK S. Sattler, D
A. Ivanov, CAN J. Segura, E
S. Kajihara, J M. Sonza-Reorda, I
R. Kapur, USA J.-P. Teixeira, P
A. Krasniewski, PL N. Touba, USA
B. Kruseman, NL J. Tyszer, PL
S. Kundu, USA R. Ubar, EE
M. Lubaszewski, BR B. Vermeulen, NL
Y. Makris, USA C. Wegener, D
H. Manhaeve, B X. Wen, J
E.J. Marinissen, B C.-W. Wu, TW
P. Maxwell, USA M. Zwolinski

Steering Committee:
Chair: H.-J. Wunderlich – U. Stuttgart (D)

Al-Hashimi, UK Z. Peng, S
B. Becker, D P. Prinetto, I
J. Figueras, E M. Renovell, F
C. Landrault, F M. Sonza Reorda, I
E.J. Marinissen, NL J.-P. Teixeira, P
P. Muhmenthaler, D Y. Zorian, USA

Organizing Committee:

A. Rueda - Local Chair
G. Huertas - Proceedings
D. Vazquez - Local Arrangement
E. Peralias &
A. Acosta
- Registration
G. Leger - Audio/visual
S. Sanchez - Web

Preliminary Call for Papers

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, practical applications, hot topics, and new trends in the area of electronic-based circuit and system testing. In 2009, ETS will take place in the nice town of Seville, Andalucía, in southern Spain. ETS’09 is being organized by Instituto de Microelectrónica de Sevilla (CSIC and Univ. de Sevilla), and is sponsored by the Test Technology Technical Council (TTTC) of the IEEE Computer Society.
You are invited to participate and submit your contributions to ETS’09. The areas of interest of ETS’09 include (but are not limited to) the following topics:

  • Automatic Test Generation
  • Fault Modeling and Simulation
  • Current-Based Test
  • Power Issues in Test
  • Thermal Test
  • Delay and Performance Test
  • High-Speed IO/Interconnect Test
  • Signal Integrity Test
  • Nanometer Technologies Test
  • ATE Hardware and Software
  • Standards in Testing
  • Test(ability) Synthesis
  • Built-In Self Test (BIST)
  • Design for Test(ability) (DfT)
  • Test Data Compression
  • On-Line Test
  • Self-Repair Methodologies
  • Test of Reconfigurable Systems
  • Analog, Mixed-Signal, RF Test
  • Memory Test and Repair
  • Microprocessor Test
  • GALS Test
  • MEMS Test
  • Digital Power Supply Testing
  • Failure Analysis
  • Diagnosis and Debug
  • Design Verification and Validation
  • Lifetime Test
  • Test Quality and Reliability
  • Yield Analysis and Enhancement
  • Defect and Fault Tolerance
  • Board and System Test
  • Embedded Systems Test
  • High-Level DfT and TPG
  • System-on-Chip (SoC) Test
  • System-in-Package (SiP) Test


Publications – ETS’09 will produce a Formal Proceedings, published by the IEEE Computer Society, and a Web-Based Electronic Informal Digest of the selected papers. The best contributions will be selected for submission to regular issues of the “Journal of Electronic Testing: Theory and Applications” (JETTA), published by Springer. ETS’09 will present a Best Paper Award at ETS’10.


Submissions – ETS’09 seeks original, unpublished contributions of the following types:

        • Scientific papers, presenting novel and complete research work
        • Workshop-type papers, including emerging ideas and practical case studies
        • Vendor Session presentations, focusing on new features of test-related products
        • Proposals for panels, embedded tutorials, and other special sessions.

Detailed submission instructions, including selection criteria and publication policies, for the various types of contributions are posted on the ETS web page.

IEEE TTTC Test Technology Educational Program (TTEP) tutorials on test technology topics will be offered during ETS’09. Tutorial proposals should be submitted according to TTEP 2009 submission deadlines (

As a new initiative for ETS’09, a Ph.D. Forum will be organized. Moreover, the ETS’09 organizing committee would like to encourage the organization of fringe workshops and will provide extensive support for the organization of such events. Full details can be found on the ETS web page.

Key Dates:

·  Submission deadline:  December 14, 2008
·  Notification of acceptance:  February 16, 2009
·  Camera-ready manuscript :  March 16, 2009

Further Information:

José Luís Huertas – General Chair
IMSE-CNM, Univ. Sevilla
Avda. Reina Mercedes S/N
41012 Sevilla, Spain
Tel.: +34-95-505-6666
Fax: +34-95-505-6692



J. Paulo Teixeira – Program Chair
IST, Tech. Univ. Lisbon, INESC-ID
R. Alves Redol, 9
1000-029 Lisboa, Portugal
Tel.: +351-21 31 00 254
Fax: +351-21 314 58 43


Visit the ETS web page at:   

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