Group of Analog and Mixed-Signal Microelectronics
The group of Analog and Mixed-Signal Microelectronics is dedicated to the design of analog and mixed-signal integrated circuits. Special is given to the following lines:
- Low-power and low-voltage design techniques in deep sub-micron technologies
- A/D converters, time-to-digital converters and mixed-signal interfaces
- Smart implantable and portable biosensing devices
- CMOS image sensors, time-of-flight sensors, single-photon detectors and vision chips;
- Heterogeneous sensor/processor microsystems; vertically integrated circuit design (CMOS-3D).
Objectives of the group
- Conceiving new analog and mixed-signal block topologies suitable for sub-micron and nanometric implementation.
- High order effect modeling and incorporation to the design flow.
- Exploration of fundamental limits and effect of scaling in circuit blocks.
- Developing top-down methodologies for the design of ADCs and DACs with optimized performance.
- Exploring reconfiguration strategies for the implementation of adaptive interfaces
- Searching for technologies that allow miniaturization of biomimetic systems, e. g. neural implants for scientific, surgical or traslational use.
- Developing processing algotrithms for neural data processing.
- Wireless sensor nodes implementation
- Studying passive RF identifiers
- Designing transceivers for body area networks.
- Studying new pixel topologies for an enhanced sensitivity,
- Designing smart image sensors with on-chip feature extraction
- Studying new CMOS-compatible pixels for single-photon detection and time-of-flight measurement
- Developing new architectures for distributed and hierarchical image processing
- Designing scene representation schemess oriented to the development of collaborative vision applications.
- Studying CMOS-compatible materials and devices for multi-spectral and 3D vision
- Making use of 3D-integration-technology-adapted architectures for multilayer and multiscale image processing